Anodic bonding method for adhesion enhancement of conducting films to dielectric substrates
- 1 — Ph.D., Dr.Sci. professor Saint Petersburg State Mining Institute (Technical University)
- 2 — Ph.D. associate professor Saint Petersburg State Mining Institute (Technical University)
Abstract
The appearance of great pulling electric fields at anodic bonding process with a conductor surface to ionic dielectric turns out to be possible due to the interlayer polarization developing in dielectric under the action of electric voltage. This results in a negative charge accumulation in a layer of small thickness beside anode. Thus applied electric voltage is distributed not through the whole thickness of a dielectric, but in fact is applied to a narrow area of the three-dimensional charge beside anode. Arising strong electric fields force the connected materials to unite. In the present work it is shown that use of the discussed technology allows to increase considerably adhesion of conducting films to dielectric substrates both in the process of their deposition and after it.
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