Non-destructive strength testing of anodic bonding conductor-to ionic dielectric seals
Authors:
About authors
- Saint Petersburg State Mining Institute (Technical University)
Abstract
Physical processes that lead to the emergence of large forces of attraction between bodies, joined by anodic bonding technology result from the large electric fields strengths at the ontact interface. Nondestructive method of monitoring the strength of obtained conductor-to ionic di- electric anodic bonding seals is based on the relationship between the dependence of current versus time flowing in the formation of seals and the strength of the resulting seals. Theoreti cally justified a new technological method for manufacturing of high-quality anodic bonding seals. The results obtained are confirmed experimentally.
Область исследования:
(Archived) Basic research in natural sciences
Funding:
None
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