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Vol 196
Pages:
356-360
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RUS
Article

Use of power action of electric field for temporary and permanent connection of materials

Authors:
N. S. Pshchelko1
A. S. Poll2
D. O. Repetuh3
About authors
  • 1 — Ph.D. associate professor Saint Petersburg State Mining University
  • 2 — student Saint Petersburg State Mining University
  • 3 — student Saint Petersburg State Mining University
Date submitted:
2011-08-15
Date accepted:
2011-10-22
Date published:
2012-05-22

Abstract

Physical processes that lead to the emergence of large forces of attraction between bodies, joined by anodic bonding technology result from the large electric fields strengths at the contact interface. Nondestructive method of monitoring the strength of obtained conductor-to ionic dielectric anodic bonding seals is based on the relationship between the dependence of current versus time flowing in the formation of seals and the strength of the resulting seals. Theoretically justified a new technological method for nondestructive testing of high-quality anodic bonding seals. The results obtained are confirmed experimentally.

Область исследования:
(Archived) Nanotechnologies and information technologies
Keywords:
nondestructive testing adhesion electric field
Go to volume 196

References

  1. Afanasev V.P., Chigiriov D.A., Pshchelko N.S., Sidorova N.P. Influence of a dc electric field on the deposition of ion-plasma sputtering thin metal films of platinum // Proceedings of Russian Universities. Radioelectronics. Saint Petersburg. 2010. Issue 6. P.59-65.
  2. Nagorni V.S., Pshchelko N.S., Sidorova N.P. Analysis of the dynamics of the anodic bonding contact formation // Scientific and technical statements, Saint Petersburg Polytechnic University. Ser. Information technology, telecommunications and control. 2009. N 6. P.166-170.
  3. Pshchelko N.S., Stoyanova T.V. Influence of anodic bonding surface roughness contact on its power characteristics // Non Ferrous Metals. 2008. N 5. P.51-57.
  4. Gracheva I.E., Karpova S.S., Moshnikov V.A. Pshchelko N.S. Net hierarchical porous structures with anodic bonding contacts // Proceedings of the Saint Petersburg Electrotechnical Institute. 2010. N 8. P.27-32.

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